- 13 5月, 2011 1 次提交
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由 Felipe Balbi 提交于
We have a generic way of enabling/disabling different debug messages on a driver called DYNAMIC_PRINTK. Anyone interested in enabling just part of the debug messages, please read the documentation under: Documentation/dynamic-debug-howto.txt for information on how to use that great infrastructure. Signed-off-by: NFelipe Balbi <balbi@ti.com>
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- 07 5月, 2011 1 次提交
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由 Anatolij Gustschin 提交于
Commit 3dacdf11 "usb: factor out state_string() on otg drivers" broke building musb drivers since there is already another otg_state_string() function in musb drivers, but with different prototype. Fix musb drivers to use common otg_state_string(), too. Also provide a nop for otg_state_string() if CONFIG_USB_OTG_UTILS is not defined. Signed-off-by: NAnatolij Gustschin <agust@denx.de> Signed-off-by: NGreg Kroah-Hartman <gregkh@suse.de>
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- 10 12月, 2010 5 次提交
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由 Felipe Balbi 提交于
that's not used anymore. So let's drop it. Signed-off-by: NFelipe Balbi <balbi@ti.com>
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由 Felipe Balbi 提交于
musb core doesn't need to know about platform specific details. So start moving clock handling to platform glue layer and make musb core agnostic about that. Signed-off-by: NFelipe Balbi <balbi@ti.com>
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由 Felipe Balbi 提交于
... then we don't need to export any symbols from glue layer to musb_core. Signed-off-by: NFelipe Balbi <balbi@ti.com>
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由 Felipe Balbi 提交于
that structure currently only holds a device pointer to our own platform_device and musb's platform_device, but soon it will hold pointers to our clock structures and glue-specific bits and pieces. Signed-off-by: NFelipe Balbi <balbi@ti.com>
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由 Felipe Balbi 提交于
Just adding its own platform_driver, not really using it yet. When all HW glue layers are converted, more patches will come to split power management code from musb_core and move it completely to HW glue layer. Signed-off-by: NFelipe Balbi <balbi@ti.com>
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- 07 12月, 2010 1 次提交
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由 Felipe Balbi 提交于
preparing to a big refactor on musb code. We need to be able to compile in all glue layers (or at least all ARM-based ones) together and have a working binary. While preparing for that, we move every glue layer to export only one symbol, which is a struct musb_platform_ops, and make all other functions static. Later patches will come to allow for compiling all glue layers together and have a working binary. Signed-off-by: NFelipe Balbi <balbi@ti.com>
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- 23 10月, 2010 1 次提交
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由 Sergei Shtylyov 提交于
Texas Instruments DA8xx/OMAP-L1x glue layer for the MUSBMHRDC driver. Signed-off-by: NSergei Shtylyov <sshtylyov@ru.mvista.com> Signed-off-by: NYadviga Grigorieva <yadviga@ru.mvista.com> Signed-off-by: NFelipe Balbi <balbi@ti.com> Signed-off-by: NGreg Kroah-Hartman <gregkh@suse.de>
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