We have a generic way of enabling/disabling
different debug messages on a driver called
DYNAMIC_PRINTK. Anyone interested in enabling
just part of the debug messages, please read
the documentation under:

Documentation/dynamic-debug-howto.txt

for information on how to use that great
infrastructure.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

Commit 3dacdf11 "usb: factor out state_string() on otg drivers"
broke building musb drivers since there is already another
otg_state_string() function in musb drivers, but with different
prototype. Fix musb drivers to use common otg_state_string(), too.

Also provide a nop for otg_state_string() if CONFIG_USB_OTG_UTILS
is not defined.
Signed-off-by: NAnatolij Gustschin <agust@denx.de>
Signed-off-by: NGreg Kroah-Hartman <gregkh@suse.de>

that's not used anymore. So let's drop it.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

musb core doesn't need to know about platform
specific details. So start moving clock
handling to platform glue layer and make
musb core agnostic about that.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

... then we don't need to export any symbols
from glue layer to musb_core.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

that structure currently only holds a device
pointer to our own platform_device and musb's
platform_device, but soon it will hold pointers
to our clock structures and glue-specific bits
and pieces.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

Just adding its own platform_driver, not really
using it yet.

When all HW glue layers are converted, more patches
will come to split power management code from musb_core
and move it completely to HW glue layer.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

preparing to a big refactor on musb code. We need
to be able to compile in all glue layers (or at
least all ARM-based ones) together and have a
working binary.

While preparing for that, we move every glue
layer to export only one symbol, which is
a struct musb_platform_ops, and make all
other functions static.

Later patches will come to allow for compiling
all glue layers together and have a working
binary.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.
Signed-off-by: NSergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: NYadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: NFelipe Balbi <balbi@ti.com>
Signed-off-by: NGreg Kroah-Hartman <gregkh@suse.de>